By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)
While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing swap. sponsored by way of greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.
A consultant to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the creation and use of solders. an summary of the foundations of soldering know-how is equipped starting with the speculation underlying each one inspiration. concentrating on the main updated tools for checking out and characterization, those theories are then strengthened by way of experimental examples and business applications.
• Addresses key matters in meeting from a fabrics element of view.
• supplies the reader handy entry to information crucial for the correct review and employment of state of the art ternary Sn/Ag/X solders
• permits comparability of the functionality of Pb-free solders with that of ordinary eutectic SnPb.
Although essentially of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A consultant to Lead-free Solders can be helpful for graduate scholars seeking to follow services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent learn at their fingertips including the most probably instructions will desire from such study within the future.
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Extra info for A Guide to Lead-free Solders: Physical Metallurgy and Reliability
1998), “GHz Flip Chip — An Overview”, Proceedings of Electronic Component and Technology Conference, pp. 297301. , (2003) A Discussion of the Significance of Metal Whisker Formation to the High Reliability Community. CALCE Center, (2003), “How to Prepare for Lead Free Soldering”, CALCE Short Course, 2003. Choi, W. , Lee, T. , Tu, K. , Celestre, R. , MacDowell, A. , Bong, Y. , Sheng, G. , (2002), Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, 2002. , (2002) Relay Failure Caused by Tin Whiskers, 2002.
2227, 1999. Gaylon, G. (2003), “Annotated Tin Whisker Bibliography”, NEMI Monograph, July 2003. , and Westby, G.
And Fox, L. , (1988), “Fatigue of Solder Joints in Surface Mount Devices”, Low Cycle Fatigue, ASTM STP 942, Philadelphia, PA, pp. 588610. ”, Proc. IPC Printed Circuits Expo, Long Beach, CA, March, 1999. References 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 27 Solomon, H. (December 1989), “Low Cycle Fatigue Behavior of Surface Mounted ChipCarrier/Printed Wiring Board Joints”, IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol. 12. No. 4, pp. 473479. Solomon, H. , (1986) “Fatigue of 60/40 Solder”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol.
A Guide to Lead-free Solders: Physical Metallurgy and Reliability by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)